Calex Mfg. Co., Inc. of Concord, California announces the 400W FCM Chassis Mount DC/DC Converter Series. The FCM Series features an ultra wide 4:1 input range of 18 to 75VDC with output voltages of 5, 12, 24, 28 and 48VDC. All models are isolated input to output and housed in a rugged, encapsulated enclosure with recessed barrier strips. The operating temperature range of the FCM is -40 to +100C. Through holes are provided for backplane mounting or the attachment of a heatsink for extended temperature operation. The FCM is ideal for a variety of industrial and COTS military applications requiring screw terminal connectivity (+)
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Five Year Warranty
All models feature undervoltage lockout, pulse by pulse current limiting, over-temperature protection, output overvoltage protection, input reverse voltage protection and over-current protection
Output voltage accuracy for all output voltage options is +/- 1%
The 3U VPX Mini ATR in a rugged OpenVPX platform designed for use in harsh environments where SWaP is critical. Measuring only 133 mm high x 180 mm wide x 250 mm deep, the compact unit is ideal for space constrained environments. (+)
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The new Mini ATR ships configured with a 3-slot, 3U OpenVPX backplane, designed to VITA 65
can be configured with solid state storage and a 250 W power supply
The unit can be modified to accommodate a plug-in version of the power supply module, providing up to 350 W VDC
The XIt1022 is an RTM Module that supports I/O for the XPort1020 6U cPCI module. The XIt1022 routes up to twelve serial interfaces, consisting of TXD, RXD, TXC, RXC, RTS, CTS, DCD, AC, DTR, DSR, RI, and RL from the XPort11020 J3, J4, and J5 connectors to the XIt1022's front panel. (+)
The XIt1033 provides I/O expansion for 3U cPCI SBCs. The XIt1033 provides rear-panel connectors for two 10/100/1000BASE-T ports, a USB port, a SATA port, and either a second SATA port or two RS-232 ports via micro-DB-9 connector. The XIt1033 provides board connectors for an additional four USB ports and 4-5 SATA ports (six total on card). When mated with the optional XIt1034, an additional two Mini-HDMI (DVI) ports are also provided. (+)
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3U cPCI Rear Transition Module
Support for X-ES's 3U cPCI SBC module I/O
Two RJ-45 connectors for dual 10/100/1000BASE-T ports
The XIt1010 is a 6U VME Rear Transition Module (RTM) which supports various X-ES Single Board Computer (SBC) products. When installed in an RTM slot of an appropriate VME64 backplane, the XIt1010 routes I/O signals from an associated SBC's rear panel P0 and P2 connectors to connectors on the XIt1010, to allow connection of these signals to external equipment. (+)
The XIt2041 is a PMC I/O Module (PIM), per the VITA 36 specification, which supports various X-ES PrPMC/XMC products. When installed on the appropriate carrier, such as the XTend3100 or XIt1003, the XIt2041 routes I/O signals from an associated PrPMC/XMC's rear panel P14 connector to allow connection of these signals to external equipment. The XIt2041 breaks out 10/100/1000BASE-T Ethernet, RS-232 serial, SATA, USB, and DVI signals to the appropriate connectors located on the front panel and rear surface of the card. (+)
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PIM/XIM module
Two 10/100/1000BASE-T Ethernet ports to RJ-45 connectors
The XIt2040 is a PMC I/O Module (PIM), per the VITA 36 specification, which supports various X-ES PrPMC/XMC products. When installed on the appropriate carrier, such as the XTend3100 or XIt1003, the XIt2040 routes I/O signals from an associated PrPMC/XMC's rear panel P14 connector to allow connection of these signals to external equipment. The XIt2040 breaks out 10/100/1000BASE-T Ethernet and RS-232 serial to RJ-45 and micro DB-9 connectors respectively. (+)
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PIM module
# Two 10/100/1000BASE-T Ethernet ports to RJ-45 connectors
The XIt1074 provides I/O expansion for 3U VPX SBCs. It provides a PIM/XIM interface that supports I/O signal mapping to VPX via the VITA 46.9 P64s pattern for PMC and the X12d pattern for XMC. (+)
The XIt1040 is a 6U VPX Rear Transition Module (RTM) per the VITA 46.10 specification, which supports I/O breakout from various X-ES Single Board Computer (SBC) products. When installed in an RTM slot of an appropriate 6U VPX backplane, the XIt1040 routes I/O signals from an associated SBC's rear panel P2-P6 connectors through the VPX backplane to connectors on the XIt1040 to allow connection of these signals to external equipment. (+)
The XPand1300 is a low-cost flexible development platform. This system supports up to twelve 1 in. or up to fifteen 0.8 in. pitch air-cooled VPX (VITA 48.1) and cPCI (PICMG 2.0) modules. It provides 550 W of total simultaneous power, which can be distributed as up to 50 A on 12V, up to 50 A on 5V, and up to 25 A on 3.3V. Up to 20 CFM of air flow is provided per slot. (+)
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Desktop development system for air-cooled modules
Supports up to fifteen 0.8 in. or twelve 1.0 in. pitch slots
The XPand3200 redefines the limits of power, performance, and functionality in a sub-Â? ATR system. This conduction-cooled, fully ruggedized chassis is designed to meet the rigorous standards of MIL-STD-810 while integrating the latest power-saving and performance-enhancing technology. In today's avionics and ruggedized environments, size really does matter, and the XPand3200 sets a new standard for sub-Â? ATR computing. (+)
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Physical dimensions of 4.88 in. (W), 5.62 in. (H), 8.75 in. (L)
Redefines the limits of power, performance, & functionality in a sub-Â? ATR chassis. This forced air-cooled, fully ruggedized chassis is designed to meet the rigorous standards of MIL-STD-810 F/G while integrating the latest power-saving and performance-enhancing technology. The heat from the internal conduction-cooled modules is conducted to sidewall heat exchangers, where it is dissipated to the ambient environment by forced-air cooling. The XPand4201 sidewall heat exchangers have been increased by 1/2" on each side to provide increased cooling capacity over the XPand4200. (+)
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Forced air-cooled sidewall heat exchangers
Supports increased cooling through external cold plate
The XPand5200 redefines the limits of power, performance, and functionality in a sub-Â? ATR system. This natural convection-cooled or conduction-cooled, fully-ruggedized chassis is designed to meet the rigorous standards of MIL-STD-810 while integrating the latest power-saving and performance-enhancing technology. In today's avionics and ruggedized environments, size really does matter, and the XPand5200 sets a new standard for sub-Â? ATR computing. (+)
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Four conduction-cooled 0.8 in. slots
Physical dimensions of 4.88 in. (W), 5.65 in. (H), 10.30 in. (L)
The XPand6000 natural convection-cooled, fully-ruggedized ATR chassis is designed to meet the rigorous standards of MIL-STD-810 while integrating the latest power-saving, performance-enhancing, and space efficient off-the-shelf rugged technology. In today's avionics and ruggedized environments, size really does matter, and the XPand6000 sets a new standard for rugged small form factor computing systems. (+)
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Physical dimensions of 2.36 in. (W), 4.88 in. (H), 7.10 in. (L)
Supports a single ruggedized COM Express module
Supports a single conduction-cooled PMC or XMC module
The XPand6001 natural convection-cooled or conduction-cooled, fully-ruggedized ATR chassis is designed to meet the rigorous standards of MIL-STD-810 while integrating the latest power-saving, performance-enhancing, and space efficient off-the-shelf rugged technology. In today's avionics and ruggedized environments, size really does matter, and the XPand6001 sets a new standard for rugged small form factor computing systems. (+)
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Physical dimensions of 4.88 in. (W), 2.10 in. (H), 7.70 in. (L)
Supports a single ruggedized COM Express module
Supports a single conduction-cooled PMC or XMC module
The XPand6002 conduction-cooled, fully-ruggedized ATR chassis is designed to meet the rigorous standards of MIL-STD-810 while integrating the latest power-saving, performance-enhancing, and space efficient off-the-shelf rugged technology. In today's avionics and ruggedized environments, size really does matter, and the XPand6002 sets a new standard for rugged small form factor computing systems. (+)
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Physical dimensions of 4.88 in. (W), 1.90 in. (H), 7.70 in. (L)
Supports a single ruggedized COM Express module
Supports a single conduction-cooled PMC or XMC module
The XAct3000 a rugged, solid state, network attached storage (NAS) system providing up to 3.5 TB of solid state storage. This natural convection-cooled and conduction-cooled, fully ruggedized sub-1/2 ATR system is designed and tested to meet the rigorous standards of MIL-STD-810. The XAct3000 can be configured to provide from 1 TB to 3.5 TB of storage. (+)
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Storage declassification and ATA secure erase support
A PowerPC-based rugged computer-on-module (COM) that offers speeds up to 1.5 GHz via multi-core processing. Equipped with a Freescale QorIQ processor, the new XM51 is an extension on MEN Micro’s family of ruggedized COMs based on the space-saving ESMexpress standard, currently in preparation with ANSI/VITA as RSE 59. (+)
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Speeds up to 1.5 GHz via multi-core processing
Equipped with a Freescale QorIQ processor
Extension on MEN Micro’s family of ruggedized COMs
Protokraft’s Magnum - 801 Series Size 8 Cavity Insert Optoelectronic Transmitter and Receivers Improve Communications Link Performance and Reliability While Reducing Space and Weight Requirements (+)
The SVAC3 is a powerful servo controller in a compact and cost effective package. This AC powered drive is loaded with features and options that make it a great choice for many OEM applications. SVAC3 drives can be controlled via analog signal or step and direction inputs. Alternatively, they can be programmed to act as stand-alone units with the power of Q Programmerâ„¢. (+)
The standard single Mid-Size or Full-Size AMC.1 module conforming to MTCA.4 (Micro TCA Enhancements for Rear I/O and Precision Timing) with a user-programmable XC6SLX45T-2 or XC6SLX100T-2 Spartan-6 FPGA is designed for industrial, COTS, and transportation applications, where specialized I/O or long-term availability is required. The TAMC651 provides a number of advantages including a customizable interface for unique applications and a FPGA-based design to extend product lifecycle. (+)
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Double Mid-Size/Full-Size AMC.1 Type 1 compliant module with Xilinx Spartan-6 FPGA
AMC Fabric Interface x1 PCI-Express
MLVDS transceiver for AMC ports 12-15 (point-to-point) and ports 17-20 (multi-point)
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