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GE Fanuc Intelligent Platforms Announces First Rugged XMC Mezzanine Card To Offer Choice Of Three Xilinx Virtex-5 FPGAs

3 years 7 months ago → Industry News

(click image to zoom by 4.1x)

CHARLOTTESVILLE, VA June 24, 2008 GE Fanuc Intelligent Platforms today announced the XMCV5 mezzanine card with Xilinx® Virtex™-5 FPGA technology, responding to the growing importance of FPGA technology to military and aerospace customers. The XMCV5 is designed for a wide spectrum of digital signal processing (DSP) applications in ground mobile, airborne fixed- and rotary wing and naval applications including radar, sonar, signals intelligence (SIGINT), and image processing.

“In demanding signal processing applications, many customers are turning to FPGA technology because of the flexibility and performance it brings,” said Peter Cavill, General Manager, Military & Aerospace Products at GE Fanuc Intelligent Platforms. “The XMCV5 gives customers the flexibility to strike the right balance between hardware-oriented FPGA-based computing and software-based application code running on either PowerPC- or Intel-based platforms as part of a complete solution based on our industry-leading range of rugged single board computers, carrier cards, multiprocessors and sensor I/O products.”

Available in five ruggedization levels – allowing for deployment in the harshest environments – the XMCV5 is the first rugged XMC to harness the power and flexibility of all three Virtex-5 FPGA families with build options for the Virtex-5 FX100T, SX95T and Virtex-5 LX110T enabling customers to field the right solution with this leading edge COTS platform. It can be mounted on a broad range of GE Fanuc Intelligent Platforms 3U and 6U single board computers (SBCs), including the VMEbus PPC9A and VPX SBCs such as SBC610 and SBC310. It is compliant with the VITA-42 XMC mezzanine card base standard, and is available in both VITA 42.3 (PCIe®) and VITA 42.2 (Serial RapidIO) configurations.

The XMCV5 is available in a range of configurations for rugged air-cooled systems as well as in conduction-cooled form factors.

About GE Fanuc Intelligent Platforms

GE Fanuc Intelligent Platforms, a joint venture between General Electric (NYSE: GE) and FANUC LTD of Japan, is a high-performance technology company and a global provider of hardware, software, services, expertise and experience in automation and embedded computing, with products employed in virtually every industry, including manufacturing automation, defense, automotive, telecommunications, healthcare and aerospace. GE Fanuc Intelligent Platforms is a worldwide company head-quartered in Charlottesville, VA, and is part of GE Enterprise Solutions. For more information, visit www.gefanuc.com.

Source: GE Fanuc Intelligent Platforms, Inc.



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