Cooling
1 through 5 of 5 articles found
VMEbus SystemsApril 2005
Thomas Halverson (Harris Broadcast Communications and Innovative Research) Summary:Since reliable operation of electronics systems is critically dependent on satisfactory thermal performance, thermal design has become an integral part of the product design process. Further, due to continuous increases ... [ read more] VMEbus SystemsAugust 2004
Richard Jaenicke (Mercury Computer) Summary:The trend of escalating power consumption of both processors and communications infrastructure chips presents an increasing challenge for deploying high-performance processing systems in military environments. This chall... [ read more] VMEbus SystemsApril 2004
Robert C. Sullivan (Hybricon Corporation) Summary:
This article presents thermal simulation results for air cooled IEEE 1101.1 or IEEE 1110.10 style Eurocard packaging. VMEbus SystemsApril 2004
Doug Patterson (VISTA Controls) Summary:
This article describes a breakthrough thermal management technology called Enhanced Coldwall Thermal Interface (ECTI) which eliminates the 30W/slot limitation that plagued conduction cooled VMEbus systems in the past. VMEbus SystemsApril 2004
Dave Keller (Tracewell Systems) Summary:
This article describes how the application of an advanced cooling method is possible by combining two card types with seemingly incompatible cooling requirements in the same enclosure and with reasonable costs.
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